TDK Corporation, a Japanese electronics manufacturer, as per a recent press release statement, on Monday, Mar. 18th 2019, announced the new FS series of µPOL™ DC-DC converters, the most compact and highest power density point-of-load solutions for big data, artificial intelligence (AI), machine learning, 5G cells, IoT, and computing enterprise applications, at the APEC 2019 event to be held from Monday, Mar. 18th to Wednesday, Mar. 20th 2019 at the Anaheim Convention Center in Anaheim, California.
The new series, instead of using side by side discrete integrated circuit (IC) and discrete inductor (L), integrates the IC and inductor in a compact high-density configuration for space constrained low-profile power source. At 3.3 x 3.3 x 1.5 mm, the FS series limits the required external components to a bare minimum, while still offering the highest possible performance. The converter family is capable of delivering a high-density solution of 1 watt per mm 3 while saving 50% space in solution size than the other product offering in the same class. Following this, the system solution cost is further minimized, owing to reduced board size, assembly costs, as well as BOM and PCB costs. The converter family supports a wide operating temperature range (-40 °C to 125 °C).
μPOL™ technology comprises of a DC-DC converter placed in physical proximity of complex ASIC & FPGA chipsets. This physical proximity i.e. the minimized distance between the converter and the chipset, assures minimum resistance and inductance of components, which allows for faster response time, and improved regulation accuracy with dynamic load currents.